In industrial manufacturing, product assembly, home building materials, electronic hardware production, and other fields, adhesive failure, cracking, and weak bonding are frequent quality challenges. Many companies mistakenly attribute debonding issues solely to adhesive quality, while in reality, most problems stem from misjudging failure modes or mismatching adhesives with application processes. Different debonding surfaces and failure patterns correspond to distinct root causes. With years of deep expertise in industrial adhesives, Rhino Chemical has analyzed manufacturing applications across more than 30 countries worldwide and classified industrial bonding failures into four core types: cohesive failure, adhesive failure, substrate failure, and mixed failure. Accurately identifying the failure mode is critical to completely resolving debonding issues, improving bonding stability, and reducing rework costs.

Adhesives are indispensable core auxiliary materials throughout the entire process of precision assembly of electronic components and manufacturing of finished electronic products. Their performance directly affects the bonding strength, protection effect and service life of electronic components. Due to differences in composition and performance, different types of adhesives are suitable for diverse production conditions, application scenarios and process requirements. Based on the actual production needs of the electronics industry, this article systematically analyzes the core characteristics and application scopes of six mainstream adhesives, providing professional guidance on adhesive selection for electronics manufacturers.

In 2025, Chinese companies are playing an increasingly important role on the global technology stage. With the continuous progress of technology and the intensification of market competition, a group of Chinese enterprises with real core technologies have come to the fore and become an important force to promote the development of the industry and national innovation. This article will introduce 20 Chinese companies that truly possess core technologies, demonstrating their outstanding achievements and far-reaching impact in their respective fields.

prevent leakage and short circuits. It also has excellent insulation performance and can effectively prevent current leakage in high-voltage electrical equipment.

Sealing adhesive is a widely used protective material in the manufacturing of electronic components, providing a solid guarantee for the long-term stable operation of electronic products with its excellent performance.

Epoxy resin adhesive generally refers to an adhesive made of epoxy resin as the main body. Epoxy resin adhesive should generally also include epoxy resin curing agent, otherwise the adhesive will not cure.

There are epoxy groups at the ends of the resin macromolecules, hydroxyl groups and ether bonds between the chains, and hydroxyl groups and ether bonds will continue to be generated during the curing process.